Rogers TMM6 2-Layer 50mil EPIG PCB – Microwave & Stripline Applications

1. Introduction to Rogers TMM6 PCB

Rogers TMM6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability stripline and microstrip applications. TMM 6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family.

This 2-layer rigid PCB is constructed entirely with TMM6 as the core material, making it ideal for demanding RF and microwave circuitry, power amplifiers, filters, satellite communication systems, and GPS antennas. The EPIG (Nickel-free) surface finish ensures excellent solderability and wire-bonding reliability.

2. Key Features of Rogers TMM6 PCB

• Dielectric constant (Dk) of 6.0 ± 0.08 at 10GHz

• Dissipation factor of 0.0023 at 10GHz

• Thermal coefficient of Dk: -11 ppm/°K

• CTE matched to copper (18 ppm/K, 18 ppm/K, 26 ppm/K)

• Decomposition Temperature (Td): 425 °C TGA

• Thermal Conductivity: 0.72 W/m/K

• Resistant to process chemicals, reducing damage during fabrication

• Based on thermoset resin, allowing for reliable wire-bonding

• All common PCB processes can be used with TMM6 materials

3. Benefits of Rogers TMM6 PCB

• Mechanical properties resist creep and cold flow

• Resistant to process chemicals, reducing damage during fabrication

• Based on thermoset resin, allowing for reliable wire-bonding

• All common PCB processes can be used with TMM6 materials

• Exceptional Dk uniformity and tight tolerance (6.0 ± 0.08) for consistent impedance control

• Low dissipation factor (0.0023) ensures high performance at microwave frequencies

• CTE matched to copper enables high reliability plated through holes

• High thermal conductivity (0.72 W/m/K) facilitates heat removal

• Thermoset resin does not soften when heated, preventing pad lifting during wire bonding

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

6. PCB Statistics

7. Rogers TMM6 Material – Product Introduction

Rogers TMM® 6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability stripline and microstrip applications. TMM 6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family.

TMM6 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal. TMM6 laminates are based on thermoset resins, and do not soften when heated, enabling reliable wire bonding without pad lifting or substrate deformation.

8. Features and Benefits Summary

9. TMM6 Typical Properties (Data Sheet)

10. Primary Application Areas

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and couplers

• Satellite communication systems

• Global Positioning Systems (GPS) Antennas

• Patch Antennas

• Dielectric polarizers and lenses

• Chip testers

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thicknesses, Panel Sizes & Claddings